Monitoring Power Module Solder Degradation From Heat Dissipation in Two Opposite Directions
نویسندگان
چکیده
Solder degradation is still a main failure mechanism for power semiconductor modules. This study proposes monitoring method to detect the relative change in heat dissipation from module two opposing directions, affected by degradation—upward via silicone gel and downward solder layer heatsink. The based on external package measurements, condition indicator $\gamma $ defined as ratio of transfer rates directions. expected response level analyzed different operating points environment conditions. demonstrated experiment.
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ژورنال
عنوان ژورنال: IEEE Transactions on Power Electronics
سال: 2022
ISSN: ['1941-0107', '0885-8993']
DOI: https://doi.org/10.1109/tpel.2022.3157464